UV-diamond series high power UV laser

1
2
3
4
5
  • 1
  • 2
  • 3
  • 4

Details

Stone series,  with ultra-high cost performance, can meet 7*24 hours manufacturing; Stone plus series, stronger performance, more adaptable to complex and harsh environments.
● The laser power 3-12W;
● Solve power attenuation and meet 7*24 hours of work;
● The service life exceeds 20,000 hours, maintenance-free, no need for regular commissioning;
● All-in-one machine, directly installed with galvanometer, compatible with the rack of fiber laser marking machine;
● 3 layers of protection, protection grade IP65, more suitable for harsh working environment.

 

Features

  • 15-30W
    The laser power

  • UV-clean
    Patented technology

  • 20000 hours
    The service life

Technical parameter

Model No. MMEPU-D-355-15 MMEPU-D-355-18 MMEPU-D-355-20 MMEPU-D-355-25 MMEPU-D-355-30
Optical Characteristics  
Wavelength (nm) 355nm±1nm
Average Power (W) >15W@50kHz >18W@50kHz >20W@50kHz >25W@50kHz >30W@50kHz
Single Pulse Energy (uJ) ~300uJ@50kHz ~350uJ@50kHz ~400uJ@50kHz ~500uJ@50kHz ~600uJ@50kHz
Pulse Width (ns) 15ns@50kHz 12ns@50kHz 12ns@50kHz 12ns@50kHz 12ns@50kHz
Repitition Rate 50kHz-500kHz
Pulse Stability <3% rms
Long Term Stability <±3%
Beam Characteristics  
Polarization Ratio Horizontal;>100:1
Beam Diameter ~1mm(at exit)/~6mm(6X beam divergence)
Beam Circularity >90%
Spatial Mode TEM00, M2 <1.1
Operating Specifications  
Warm-up Time <15 minutes from cold start
Electrical Requirement DC24V,500W
Ambient Temperature 10-35℃, RH<80%
Storage Conditions -10-40℃, RH<90%
Physical Characteristics  
Cooling System Water-Cooled
Water Temperature (laser inlet) 25℃

 

 

>>>

Application

Solar cell scribing,PCB&FPC splitting and cutting,Silicon wafer scribing ,Film cutting
Solar cell groove

Solar cell groove

FPC cutting

FPC cutting

PCB

PCB

Silicon wafer engraving

Silicon wafer engraving

  • 1
  • 2
  • 3
  • 4

More application

Integrated circuit characterization

Integrated circuit characterization

Integrated circuit characterization

Integrated circuit characterization

 Ceramic cutting

Ceramic cutting

PCB

PCB

  • 1
  • 2
  • 3